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Electronic Packaging Market Share, Size 2019-2024 | Industry Analysis, Overview of Market Dynamics, Top Key Players, and Regional Forecast to 2024

Electronic

The “Electronic Packaging Market” report 2019 provides information for market players, stakeholders, investors, and business strategists to achieve a leading position the market. It maintains the record of Unusual growth strategies adopted by various companies are creating new standards for competition in the global Electronic Packaging market. Businesses around the world are aiming at increasing their profit margin and establishing a stronghold in the global market. The impact of prevailing regulatory scenario on both regional and worldwide Electronic Packaging market is provided in detail in the report.

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Electronic Packaging Market Covers Key Players:

  • AMETEK Inc.
  • Dordan Manufacturing Company
  • E. I. du Pont de Nemours and Company
  • GY Packaging, Plastiform Inc.
  • Kiva Container Corporation
  • Primex Design & Fabrication
  • Quality Foam Packaging Inc.
  • Sealed Air Corporation
  • The Box Co
  • Op
  • UFP Technologies, Inc.

    Market Overview:

  • The electronic packaging market was valued at USD 860.799 million in 2018, and is expected to reach USD 2384.12 million by 2024, at a CAGR of 18.51% over the forecast period (2019 – 2024). Consumer electronics segment is the largest sector of the market studied, due to the rising demand for products, such as TVs, set-top boxes, MP3 players, digital cameras, and the processes are generally more suited for mass production.
  • – Moreover, many devices used in the healthcare sector depends on semiconductor manufacturing technology, which, in turn, is expected to impact the electronic packaging market.
  • – Furthermore, the global wi-fi chipset market is experiencing the transition to 5th Wi-Fi generation, the 802.11ac with MIMO. An increasing number of customers are likely to adopt the technology, due to an improvement in speed by up to 1.3 GHz, over a long distance, which is driving the demand.
  • – Also, the automotive sector accounts for a significant portion of the market studied, mainly, due to its increasing adoption in electric vehicles (EVs) and hybrid vehicles. As a large number of memory devices, processors, analog circuits, discrete power devices, and sensors are used in electric and hybrid vehicles, the demand is set to rise at a rapid rate, over the forecast period.

    Report Highlights:

    • The report provides a detailed analysis on current and future market trends to identify the investment opportunities
    • Market forecasts till 2024, using estimated market values as the base numbers
    • Key market trends across the business segments, Regions and Countries
    • Key developments and strategies observed in the market
    • Market Dynamics such as Drivers, Restraints, Opportunities and other trends
    • In-depth company profiles of key players and upcoming prominent players
    • Growth prospects among the emerging nations through 2024
    • Electronic Packaging Market opportunities and recommendations for new investments

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    Scope of the Report:

  • Electronic packaging is the design and production of enclosures for electronic devices ranging from individual semiconductor devices up to complete systems, such as a mainframe computer. This is being used by the consumer electronics, aerospace and defense, automotive, and healthcare industry. The electronic packaging market includes communication integrated services (ICs), memory power management devices and analog, digital and mixed-signal ICs, as these are driving a host of applications in clinical diagnostics and therapy and medical imaging.

    Key Market Trends:

    Aerospace and Defense Industry to Increasingly Adopt Electronic Packaging

    – The defense budget of developed nations and many developing nations, such as the United States, France, the United Kingdom, Russia, India, and China, etc., have been increasing regularly. Many of these nations are also into the export of weapons. It results in the continued investment in the R&D in the aerospace and defense market.
    – Moreover, several military and aerospace equipment, such as data processing units, data display systems, computers, and aircraft guidance-control assemblies are loaded with semiconductor devices.
    – Naval warships, satellite communication channels on board, weapon control system, coastguard, etc., are the users of many sophisticated electronic products and require military-grade packaging of the electronic and semiconductor components. Humidity and harsh environment make it necessary for the requirement of high-quality product and facilitates the investment in R&D.
    – Owing to these factors, electronic packaging is anticipated to witness significant growth over the forecast period.

    Asia-Pacific to Witness the Fastest Growth Rate Over the Forecast Period

    – As China is considered as the electronic hub worldwide because of the mass manufacturing and production of electrical components and electronics products in order to meet the highest standards of quality, performance, and delivery, this gives a significant growth potential to the electronic packaging market.
    – Therefore, the companies in the region are also investing in installing machinery that enables productive electronic and semiconductor packaging.
    – For instance, in 2019, KraussMaffei announced that it was going to debut a locally produced all-electric injection molding machine named “PX Agile” at Chinaplas. The new PX Agile is ideally used for standard applications like for technical components, electric and electronic devices and for the automotive, electronic packaging, and medical industries.

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    Detailed TOC of Electronic Packaging Market Report 2019-2024:

    1 INTRODUCTION
    1.1 Study Deliverables
    1.2 Study Assumptions
    1.3 Scope of the Study

    2 RESEARCH METHODOLOGY

    3 EXECUTIVE SUMMARY

    4 MARKET DYNAMICS
    4.1 Market Overview
    4.2 Market Drivers
    4.2.1 Rising Concern over Product and Consumer Safety
    4.2.2 Technological Advancements Drive the Product Quality
    4.3 Market Restraints
    4.3.1 High Costs for Electronic Packaging and Lack of Skilled Professionals to Challenge the Market Growth
    4.4 Industry Attractiveness – Porter’s Five Forces Analysis
    4.4.1 Threat of New Entrants
    4.4.2 Bargaining Power of Buyers/Consumers
    4.4.3 Bargaining Power of Suppliers
    4.4.4 Threat of Substitute Products
    4.4.5 Intensity of Competitive Rivalry
    4.5 Technology Snapshot

    5 MARKET SEGMENTATION
    5.1 By Material
    5.1.1 Plastic
    5.1.2 Metal
    5.1.3 Glass
    5.1.4 Other Materials
    5.2 By End-user Industry
    5.2.1 Consumer Electronics
    5.2.2 Aerospace and Defense
    5.2.3 Automotive
    5.2.4 Healthcare
    5.2.5 Other End-user Industries
    5.3 Geography
    5.3.1 North America
    5.3.1.1 United States
    5.3.1.2 Canada
    5.3.2 Europe
    5.3.2.1 United Kingdom
    5.3.2.2 Germany
    5.3.2.3 France
    5.3.2.4 Rest of Europe
    5.3.3 Asia-Pacific
    5.3.3.1 China
    5.3.3.2 India
    5.3.3.3 Japan
    5.3.3.4 Rest of Asia-Pacific
    5.3.4 Latin America
    5.3.5 Middle East & Africa

    6 COMPETITIVE LANDSCAPE
    6.1 Company Profiles
    6.1.1 AMETEK Inc.
    6.1.2 Dordan Manufacturing Company
    6.1.3 E. I. du Pont de Nemours and Company
    6.1.4 GY Packaging, Plastiform Inc.
    6.1.5 Kiva Container Corporation
    6.1.6 Primex Design & Fabrication
    6.1.7 Quality Foam Packaging Inc.
    6.1.8 Sealed Air Corporation
    6.1.9 The Box Co-Op
    6.1.10 UFP Technologies, Inc.

    7 INVESTMENT ANALYSIS

    8 MARKET OPPORTUNITIES AND FUTURE TRENDS

     

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