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Advanced Packaging Market 2019: Comprehensive Analysis by Top Key Companies, Industry Growth, Size, Share, Market Insights, Sales Volume and Forecast to 2024


The “Advanced Packaging Market” research report 2019 delivers comprehensive information about the market ranging from the establishment to the predictable growth trend. Advanced Packaging market report provides brief analytical data of the market contenders globally using advanced methodological approaches, such as SWOT analysis, production chain, cost, sales margin, financial details, recent developments. Advanced Packaging market report also offers market competitors that includes detailed company profiles along with company product specifications.

Market Overview:

  • The advanced packaging market was valued at USD 3,358.1 million in 2018, and it is expected to reach a value of USD 6,937.73 million by 2024, at a CAGR of 10.66% during the forecast period (2019-2024). The rise in demand for artificial intelligence (AI) will create a huge demand for semiconductors with improvements.
  • – Presently, electronic devices are readily available in different kinds of package types and include semiconductors (integrated circuits), magnets, capacitors, and resistors. The semiconductor packaging services market has drawn the greatest attention in the investment community. The change in the consumer preference for the latest technology and constant innovations by major players for electronic goods has created a huge market base for the advanced packaging market.
  • – As people are shifting toward connected devices, so an increase in the Internet of Things (IoT) will lead to the growth of semiconductor packaging. An increase in the demand for consumer wearable goods, smartphones, and home appliances will act as a positive impact on this industry.
  • – With IoT being a major driver, security is a main concern for the user. The semiconductor manufacturers have to constantly work to develop more secure chips. The industry should also align themselves with the electronics goods industry’s value chain. This alignment will increase the total cost of the ICs.

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    In Advanced Packaging Market Report, Following Companies Are Covered:

  • Amkor Technology, Inc.
  • Taiwan Semiconductor Manufacturing Company, Limited
  • Advanced Semiconductor Engineering Inc.
  • Intel Corporation
  • STATS ChipPAC Pte. Ltd
  • Chipbond Technology Corporation
  • Samsung Electronics Co. Ltd

    Advanced Packaging Market 2019 report will help the industry aspirants in arranging their strategies. The measurements offered in this report will be an exact and helpful manual to shape the business development. Additionally, will Provide historical data along with a future forecast and detailed analysis and also expected opportunities.

    Scope of the Report:

  • IC packaging in the semiconductor industry has witnessed a continuous transformation in terms of characteristics, integration, and energy efficiency of the product, owing to a vast demand across various end-user verticals of the industry. The 2D integrated circuit (2.0DIC) flip-chip and wafer-level packaging technologies witnessed solid growth over the years, owing to a number of mainstream applications, primarily in high-end smartphones and tablets that are expected to meet stringent size and power management requirements.

    Reasons for Buying Advanced Packaging Market Report:

    • This report provides pin-point analysis for changing competitive dynamics
    • It provides a forward looking perspective on different factors driving or restraining market growth
    • It provides a five-year forecast assessed on the basis of how the market is predicted to grow
    • It helps in understanding the key product segments and their future
    • It provides pin point analysis of changing competition dynamics and keeps you ahead of competitors
    • It helps in making informed business decisions by having complete insights of market and by making in-depth analysis of market segments

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    Key Market Trends:

    Fan-out Wafer Level Packaging to Provide New Opportunities for Market Growth

    – Fan-out wafer level packaging (FOWLP) has emerged as a promising technology to meet the ever increasing demands of the consumer electronic products. The main advantages of FOWLP are the substrate-less package, lower thermal resistance, a higher performance due to shorter interconnects together with direct IC connection by thin film metallization instead of wire bonds or flip chip bumps and lower parasitic effects.
    – Semiconductor devices with thousands of I/O points can be seamlessly connected via finely-spaced lines as thin as two to five microns, maximizing interconnect density while enabling high bandwidth data transfer. Significant height and cost savings are achieved via the elimination of the substrate.
    – According to the Semiconductor Industry Association report 2018, the end-use categories like computer and communications hold major sales value i.e., USD 144.3 billion and USD 151.9 billion respectively.
    – The semiconductors enable a wide variety of products for smartphones and computers and the demand for these devices is increasing year on year. A positive outlook for IoT and artificial intelligence are supplementing the growth of the semiconductor industry.

    Asia-Pacific to Witness the Highest Growth in Advanced Packaging Market

    – Asia-Pacific is expected to grow at a healthy rate, being a major revenue generating region during the forecast period, primarily owing to the growing population and the customer-side demand. Prominent semiconductor manufacturing companies present in the region are fueling the demand for advanced semiconductor packaging.
    – Moreover, China is the largest growing economy with a large population, and according to statistics from China’s semiconductor association, the import of IC is increasing for the consecutive year from 2014. The Chinese government has employed a multi-pronged strategy to support domestic IC industry development in order to achieve the goal of becoming the global leader in all primary IC industrial supply chain segments by 2030. This growth in the semiconductor IC industry in the region is anticipated to stimulate the advanced packaging demand.

    The Research Document Will Answer Following Questions Such as:

    • What are the cutting-edge technologies responsible for driving the growth of the market?
    • What are the main applications of the market? What are the growth prospects to the market applications into the market?
    • At what stage of development are the key market products?
    • What are the shortcomings that has to face to become commercially viable? Is their growth and commercialization dependent on cost declines or technological/application breakthroughs?
    • What is the outlook for the industry?
    • What difference does performance characteristics of Advanced Packaging create from those of established entities?

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    Detailed TOC of Advanced Packaging Market Report 2019-2024:

    1.1 Study Deliverables
    1.2 Study Assumptions
    1.3 Scope of the Study



    4.1 Market Overview
    4.2 Introduction to Market Drivers and Restraints
    4.3 Market Drivers
    4.3.1 Increasing Trend of Advanced Architecture in Electronic Products
    4.3.2 Favourable Government Policies and Regulations in Developing Countries
    4.4 Market Restraints
    4.4.1 Market Consolidation affecting Overall Profitability
    4.5 Industry Attractiveness – Porter’s Five Forces Analysis
    4.5.1 Threat of New Entrants
    4.5.2 Bargaining Power of Buyers/Consumers
    4.5.3 Bargaining Power of Suppliers
    4.5.4 Threat of Substitute Products
    4.5.5 Intensity of Competitive Rivalry
    4.6 Value Chain / Supply Chain Analysis

    5.1 By Packaging Platform
    5.1.1 Flip Chip
    5.1.2 Embedded Die
    5.1.3 Fi-WLP
    5.1.4 Fo-WLP
    5.2 Geography
    5.2.1 North America
    5.2.2 Europe
    5.2.3 Asia-Pacific
    5.2.4 Latin America
    5.2.5 Middle East & Africa

    6.1 Company Profiles
    6.1.1 Amkor Technology, Inc.
    6.1.2 Taiwan Semiconductor Manufacturing Company, Limited
    6.1.3 Advanced Semiconductor Engineering Inc.
    6.1.4 Intel Corporation
    6.1.5 STATS ChipPAC Pte. Ltd
    6.1.6 Chipbond Technology Corporation
    6.1.7 Samsung Electronics Co. Ltd




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